Surface  Mount Technology

• Prototyping through 5,000 class 3 assemblies per month
• Computer controlled fine pitch screen printer for solder paste, epoxy adhesive, conductive carbon, and conductive epoxy.
• Pick and place line with a maximum 21,000 placements per hour. The SMT line is an inline - conveyored system with dual vision correction for fine pitch to 12 mils. (BGA, uBGA, Flip chip, CSP, and chips components to 0402) Placement repeatability 15um / 3 sigma.
• Computer vision corrected automatic dispensing system for solder paste, epoxy adhesive, spot conformal coatings, solder masking, heated and unheated underfills.
• Automatic Optical Solder Paste Inspector, 20 Zone reflow oven with onboard temperature control and profiling, SMT reflow and rework stations. SRL automatic fine pitch rework stations, In-circuit testing and programming.

Through Hole Technology

• Prototyping to 5,000 assemblies per month
• Automatic, Semi-automatic, and Manual Component preparation
• Semi-automatic Insertion and Hand insertion
• Inline 18 inch wave soldering system, aqueous and no-clean fluxing, inline aqueous cleaning system. In-circuit testing and programming

• Cable and Wire harnesses, chassis wiring, and wire terminations.
• Final Product Assembly
• Ultrasonic Plastic Welding, and Hose Assemblies.
• Conformal Coating applied using Automatic, Semi-automatic, and Manual methods. Acrylic, Polyester, Paralene, Silicone, and Polyurethane are commonly stocked coatings.
   

• ISO 9000 Quality System for Design and Production.
• Enterprise CAM system.
• All PCB assemblies built to IPC-610C Class 2 or Class 3, J-STD-001
• Fully automatic in-circuit functional testing
• In-circuit Programming and Testing
• Burn In
• Environmental Testing
• Bed- of - Nails testing (fixtures fabricated in-house)
• Testing programs developed from customer schematics